Dynamic Testing Machine for Chip Bond and Thrust Testing Applications

Product Details
Customization: Available
After-sales Service: Online Technical Support
Warranty: 2 Year After-Sales Service
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  • Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
  • Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
  • Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
  • Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
  • Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
  • Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
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  • Overview
  • Company Profile
  • Our Customer
  • Certifications
  • WBE Team
  • After Sales Service
Overview

Basic Info.

Model NO.
WBE-9088B
Max Diameter of Workpiece
<500mm
Type
Thrust Testing Machine
Maxcapacity
<1000KN
Accuracy Grade
0.1
Load Way
Mechanical Load
Loading Method
Static Load
Display
Digital
Control
Manual Control
Weight
100g-100kg
Power Source
AC220V
Tensile Testing Range
100g to 20kg
Thrust Testing Range
250g to 100kg
Module Switching
Auto Rotation Module
X-Axis/Y-Axis
Effective Stroke 100-500mm,Resolution 0.1μm
Z-Axis Testing Min Positioning Height
<=1μm
Transport Package
Woden Box
Specification
Customized service
Trademark
WBE
Origin
Guandong, China
Production Capacity
500set/Moth

Packaging & Delivery

Package Size
450.00cm * 700.00cm * 800.00cm
Package Gross Weight
100.000kg

Product Description

Specification

Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
Bond Tester Technical SpecificationsMODEL: WBE-9088B

1.Product Overview:
Bond Tester, Masterfully designed for lead welding strength tests post-microelectronic lead bonding, our Bond Tester excels in joint and substrate surface bonding tests. It performs repetitive thrust fatigue tests for welding balls (inclusive of internal lead pull tests, micro solder joint thrust tests, golden ball thrust tests, chip shear force tests, SMT welding component thrust tests, and comprehensive BGA matrix thrust tests). This multifunctional marvel is extensively deployed in semiconductor and LED packaging, smart card packaging, and is an invaluable asset in communication electronics, automotive electronics sectors, and pivotal for electronic circuit failure analysis and testing in research institutes, colleges, and universities..
Test Item:
Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
2.Specialty:
1). Features cutting-edge imported precision sensor technology, guaranteeing exceptional product accuracy and unparalleled stability.
2). Integrates VPM vertical traction and vertical positioning technology across all testing methods;
3). Encompasses a robust four-axis movement platform, equipped with imported transmission components for swift and stable machine performance.
4). Ensures load precision with an innovative 7-stage automatic shift function, delivering high precision throughout the full range.
5). Delivers extensive test data comprehensively displayed in computer waveform charts, histograms, detailed data reports, and more;
6). Facilitates automatic rotation and seamless conversion between tensile, small-range thrust, and large-range thrust tests.
7). Boasts a 32-bit high precision and high-resolution AD converter for advanced testing requirements.
8). Each sensor is individually equipped with an anti-collision overload protection system, preventing precision deviations caused by operational errors.
9). Employs cutting-edge mechanical equipment control technology featuring three closed loops: load, displacement, and speed.
10). Includes an automatic correction function, with options for specialized correction fixtures and weights.
11). Assembled with components from top-tier international suppliers, ensuring product excellence and durability.;
3.Technical Specification:
1).The typical range selections for tensile testing include: 100 g, 200 g, 1 kg, 5 kg, 10 kg, and 20 kg, each offering a testing precision of 0.1%. Additionally, other ranges can be customized to meet specific testing requirements.)
2).Commonly used thrust test range selections include versatile options such as 250g, 1kg, 5kg, 20kg, and 100kg, all while maintaining an outstanding test accuracy of 0.1%. Additional ranges can be accommodated based on specific testing requirements, ensuring comprehensive versatility for diverse testing needs. Our state-of-the-art solutions transcend the ordinary, being fully customizable and meticulously crafted to address your unique needs and preferences. Embrace the flexibility and adaptability of our products to achieve unparalleled performance.)
3). Advanced software integration ensures seamless operation with an intuitive, user-friendly interface. Navigate your testing processes with ease and efficiency, optimizing productivity like never before. Comprehensive support services are at your disposal, offering dedicated assistance at every step of your journey. Our commitment to your success is unwavering, providing you with expert guidance and solutions.: The machine is engineered for precision with chip thrust tests, gold wire tensile tests, and golden ball thrust tests, ensuring unparalleled accuracy and reliability in all testing scenarios.
4).X axis: Experience cutting-edge precision with an effective stroke of 100mm, a top speed of 5 mm/s, and an incredible resolution of 0.1μm. This axis promises to enhance your testing capabilities with unmatched accuracy.
5).Yaxis: This axis delivers an effective stroke of 100mm, a maximum speed of 5 mm/s, and a resolution of 0.1μm, ensuring precise and reliable testing.
6). Z axis: With an effective stroke of 100mm complemented by a maximum speed of 7mm/s, it achieves a resolution of 0.1μm, delivering meticulous precision for your testing applications.
7).Zaxis test minimum positioning height: This feature guarantees unrivaled accuracy with a minimum positioning height of ≤0.5μm, setting a new standard for precision testing.
8).Platform fixture: Our adaptable platform is engineered for versatility, supporting a variety of fixtures, each capable of rotating a full 360 degrees, ensuring optimal adaptability for every test.
9).Four-axis movement platform: Our equipment boasts state-of-the-art imported transmission parts, ensuring high-speed efficiency and long-term stability in operations, thus enhancing your productivity.
10).The machine is equipped with a sophisticated computer Windows operating system, featuring intuitive software operation that effortlessly displays test data and force distribution curves, empowering you with comprehensive insights.
11).Microscope: Offers an impressive 1~60 times magnification, allowing for detailed examination and precision analysis, elevating your testing capabilities to new heights.
12).Compressed air: Operates efficiently at 4.5~6Bar pressure, conforming to industrial standards and ensuring optimal performance in every operation.
13).Vacuum supply: Maintains a steady 550mm Hg, ensuring reliable vacuum operations for all your testing requirements.
14). Dimensions: With a compact and thoughtfully designed structure, measuring W430mm x D665mm x H790mm, our machine is primed to fit seamlessly into various industrial setups.
15). Weight: Weighing in at a robust 95KG, the machine ensures durability and stability while operating at a power supply of 220V±5%, 50-60HZ, delivering consistent performance.
16). Power: Capable of delivering a powerful 1KW/4.5A;
4.Software Screen: Explore the next-level interface design with our cutting-edge software screen, seamlessly integrating functionality and user-friendliness to enhance your testing experience.:
Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
5.Test Fixture: Experience unparalleled precision and support with our expertly engineered test fixture, crafted to ensure stable and accurate testing every time.
Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
6.Test Product Diagram: Discover the intricate details of our state-of-the-art product diagram, designed to provide clear, insightful visualization of every element in your testing process.
Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
Dynamic Testing Machine for Chip Bond and Thrust Testing Applications
Dynamic Testing Machine for Chip Bond and Thrust Testing Applications

Company Profile


Dynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing Applications

At Dongguan Weibang Instrument Equipment Co., Ltd., we are resolutely dedicated to pioneering sustainable practices. Our unwavering focus on groundbreaking research and the relentless pursuit of innovation sets us at the forefront of our industry, as we strive to shape the future with visionary advancements.

Guangdong Weibang Instrument Technology Co., Ltd.,known affectionately as WBE, was established in 1995 and proudly anchors itself in the vibrant heart of Changping, Dongguan, situated within the dynamic confines of the Hong Kong-Macao Greater Bay Area. As a trailblazing high-tech enterprise, we are equipped with an avant-garde brand technology team. Our sprawling facilities encompass over 12,000 square meters, housing cutting-edge, independently managed factories that excel in meeting diverse and unique customized production needs. With our steadfast commitment to excellence, we have strategically established five major marketing service centers across China in pivotal cities such as Beijing, Chongqing, Xi'an, Suzhou, and Dongguan. These centers are meticulously designed to offer unmatched convenience and efficiency to our esteemed clientele. Our comprehensive product portfolio includes versatile, weather-resistant environmental testing chambers, expansive non-standard environmental testing chambers, precision chip packaging push and pull testing machines, alongside mechanical and environmental combination non-standard testing machines, all crafted with engineering precision and expertise.
Our distinguished clientele encompasses a spectrum of cutting-edge technological industries, spanning sectors such as industry, semiconductors, automotive electronics, testing units, new energy, research institutions, optoelectronics, and healthcare. We stand with pride at the pinnacle of our industry, consistently leading in the research and innovation of analogous products, setting benchmarks and inspiring advancements.
Our Customer

Dynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing Applications

Certifications

Dynamic Testing Machine for Chip Bond and Thrust Testing Applications

WBE Team

Dynamic Testing Machine for Chip Bond and Thrust Testing ApplicationsDynamic Testing Machine for Chip Bond and Thrust Testing Applications

After Sales Service

Our all-encompassing after-sales suite offers a rich tapestry of services, featuring comprehensive product introductions, swift and reliable delivery, seamless expert installation, meticulous commissioning, scheduled maintenance regimes, detailed technical training, rapid on-site assistance, and insightful consulting tailored to your needs.

At Weibang Instrument, we define after-sales service as a holistic, customer-centric support framework activated post-purchase to swiftly address and resolve any client concerns. Our unwavering commitment focuses on prioritizing and resolving pressing customer needs with unmatched efficiency and personalized care.

Guided by our SLA service objectives, we ensure accuracy and consistency across our after-sales processes. This strategic approach assures that every customer inquiry is addressed within a predefined timeframe, customized to meet the diverse needs of different customer tiers, thereby standardizing and enhancing service delivery. Every request is diligently transformed into a service work order, enabling systematic processing and comprehensive archiving. This facilitates effective tracking, timely follow-ups, and mitigates service lapses caused by human or spatial oversights, significantly elevating our management standards and service quality.
Dynamic Testing Machine for Chip Bond and Thrust Testing Applications

Detailed Service Item Overview

Dedicated and Responsible After-Sales Support: An Unmatched Commitment

1. We provide expert installation and precise product debugging, ensuring flawless integration and operation for every customer.

2. Tailored technical guidance is rendered to fulfill specific customer requirements, greatly enhancing product usability and customer satisfaction.

3. A steadfast supply of critical spare parts is guaranteed, ensuring seamless maintenance and prolonged product life.

4. Our dedicated team commits to offering comprehensive maintenance services, including both routine and scheduled inspections, to guarantee optimal product performance and reliability.

5. We nurture strong and lasting customer relationships through regular phone check-ins or bespoke home visits, ensuring ongoing and personalized support.

6. Our robust 'three guarantees' policy delivers unparalleled product assurance, exceeding conventional after-sales commitments and expectations.

7. We diligently manage customer communications through letters, visits, or calls, proactively resolving complaints and inquiries. By collecting valuable feedback on product quality, we ensure timely enhancements and drive continuous improvement, creating a cycle of excellence.



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