Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes

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Customization: Available
After-sales Service: Online Technical Support
Warranty: 2 Year After-Sales Service
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  • Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
  • Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
  • Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
  • Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
  • Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
  • Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
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  • Overview
  • Company Profile
  • Our Customer
  • Certifications
  • WBE Team
  • After Sales Service
Overview

Basic Info.

Model NO.
WBE-9088B
Max Diameter of Workpiece
<500mm
Type
Thrust Testing Machine
Maxcapacity
<1000KN
Accuracy Grade
0.1
Load Way
Mechanical Load
Loading Method
Static Load
Display
Digital
Control
Manual Control
Weight
100g-100kg
Power Source
AC220V
Tensile Testing Range
100g to 20kg
Thrust Testing Range
250g to 100kg
Module Switching
Auto Rotation Module
X-Axis/Y-Axis
Effective Stroke 100-500mm,Resolution 0.1μm
Z-Axis Testing Min Positioning Height
<=1μm
Transport Package
Woden Box
Specification
Customized service
Trademark
WBE
Origin
Guandong, China
Production Capacity
500set/Moth

Packaging & Delivery

Package Size
450.00cm * 700.00cm * 800.00cm
Package Gross Weight
100.000kg

Product Description

Specification

Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
Bond Tester Technical Specification MODEL: WBE-9088B

1.Product Overview:
Bond Tester, Experience unparalleled precision with our Bond Tester, meticulously crafted to perform a comprehensive array of tests! From lead welding strength evaluation post microelectronic lead bonding to intricate joint and substrate surface tests, this versatile machine excels in a multitude of applications. It includes repetitive thrust fatigue tests of welding balls, internal lead pull assessments, micro solder joint thrust examinations, golden ball thrust evaluations, chip shear force analysis, and SMT welding component thrust scrutiny. Notably, the BGA matrix can be subjected to an overall thrust test, making this equipment an indispensable asset across semiconductor packaging, LED packaging, smart card packaging, and more. Its applications extend into the communication electronics and automotive electronics sectors, as well as various research institutes, colleges, and universities, providing exceptional value in electronic circuit failure analysis and testing..
Test Item:
Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
2.Specialty:
1). Experience unwavering precision and stability with our imported precision sensor technology;
2). Enhanced VPM vertical traction and positioning technology ensure optimal test method application;
3). Features a high-speed, stable operation four-axis movement platform with imported transmission parts;
4). 7 automatic shift function delivers exceptional load accuracy across a full range of high precision;
5). Comprehensive test data presentation in waveform charts, histograms, and detailed data reports;
6). Effortless module conversion for tensile tests, small and large range thrust tests;
7). Boasts a 32Bits high precision and high-resolution AD converter for unmatched accuracy;
8). Advanced anti-collision overload protection for each sensor prevents precision deviations;
9). Leverages state-of-the-art mechanical control with three closed loops: load, displacement, and speed;
10). Equipped with an automatic correction function and customizable correction fixtures and weights;
11). Exclusively utilizes imported premium parts for superior performance;;
3.Technical Specification:
1).Tensile testing offers a versatile range selection including 100 g, 200 g, 1 kg, 5 kg, 10 kg, and 20 kg, with an impressive test precision of 0.1%; (Other ranges are customizable)
2).Thrust test commonly used range selection covers 250g, 1kg, 5Kg, 20kg, and 100kg, ensuring a test accuracy of 0.1%; (Other ranges are A truly customizable experience awaits with our Comprehensive Thrust Testing Machine. Tailor it to your specific bond evaluation needs seamlessly.)
3). Our advanced software is supported by a robust infrastructure,: providing expertise in chip thrust testing, gold wire tensile testing, and golden ball thrust testing;
4).X axis: offers an effective stroke of 100mm, with a maximum speed of 5 mm/s, and an exceptional resolution of 0.1μm;
5).Y axis: mirrors the X axis with an effective stroke of 100mm, a maximum speed of 5 mm/s, and a resolution of 0.1μm for precise operations;
6). Z axis: crafted for greater velocity with an effective stroke of 100mm, maximum speed of 7mm/s, and precision resolution of 0.1μm;
7).Z axis test supports a minimum positioning height of ≤0.5μm, ensuring pinpoint accuracy;
8).Platform fixture: allows for versatility with a variety of fixtures, each capable of a full 360-degree rotation;
9).The four-axis movement platform employs imported transmission parts to guarantee high-speed, long-term stability, and smooth operation;
10).This machine is equipped with a Windows operating system, ensuring simple software operation, and offers detailed test data and force distribution curves;
11).Microscope: offers magnification from 1 to 60 times, providing detailed views;
12).Compressed air requirement: between 4.5 to 6Bar;
13).Vacuum supply: maintains a steady 550mm Hg;
14). Dimensions: compact yet powerful, measuring W430mm x D665mm x H790mm;
15). Weighing in at 95KG, it operates efficiently on a power supply of 220V±5%, 50-60HZ;
16). Power:1KW/4.5A;
4.Software screen:
Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
5.Test fixture:
Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
6.Test product diagram:
Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes
Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes

Company Profile


Comprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation Processes

With an unwavering commitment to sustainable operations, Dongguan Weibang Instrument Equipment Co., Ltd. emphasizes pioneering research and development innovations that set us apart in the industry.

Guangdong Weibang Instrument Technology Co., Ltd.,Known in the industry as WBE, this cutting-edge enterprise was established in 1995. Our headquarters are strategically located in the bustling Changping area of Dongguan, within the Guangdong-Hong Kong-Macao Greater Bay Area. As a high-tech enterprise, we boast a distinguished frontline brand technology team. Our expansive facilities span over 12,000 square meters of modern, independent factories designed to accommodate a variety of non-standard customized production demands. We have established five major marketing service centers across China in key locations such as Beijing, Chongqing, Xi'an, Suzhou, and Dongguan. This strategic positioning allows us to deliver exceptionally convenient and efficient services to our clients. Our diverse product offerings include state-of-the-art weather-resistant environmental testing chambers, large-scale non-standard environmental testing chambers, versatile chip packaging push and pull testing machines, as well as integrated mechanical and environmental combination non-standard testing machines.
Our diverse clientele spans a wide spectrum of technological industries including industrial sectors, semiconductors, automotive electronics, testing units, new energy, research institutions, optoelectronics, and healthcare. We pride ourselves on being industry leaders in the research and innovation of our product offerings, consistently staying ahead of trends and advancements within the same industry.
Our Customer

Comprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation Processes

Certifications

Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes

WBE Team

Comprehensive Thrust Testing Machine for Chip Bond Evaluation ProcessesComprehensive Thrust Testing Machine for Chip Bond Evaluation Processes

After Sales Service

Our comprehensive services encompass everything from product introduction and seamless delivery, to expert installation and meticulous commissioning. We ensure peace of mind with ongoing maintenance, technical training, and on-site assistance. Additionally, our consultancy services are always at your disposal to answer any questions.

At Weibang Instrument, we define after-sales service as a commitment to providing tailored solutions post-purchase. Whether it's products or services, we prioritize customer concerns with a sense of urgency, ensuring swift and efficient resolution of any issues.

By leveraging SLA service goals, we ensure all after-sales support adheres to stringent standards, guaranteeing timely completion of service requests. We differentiate service levels based on customer tiers, ensuring excellence in standardization. Each request is meticulously tracked and archived as service work orders, preventing lapses due to personnel or spatial constraints, thereby elevating management and service quality.
Comprehensive Thrust Testing Machine for Chip Bond Evaluation Processes

Service Item Details

Dedicated After-Sales Service with a Commitment to Responsibility

1. Expert installation and precise debugging of products at the customer's site;

2. Provide comprehensive technical guidance as per customer specifications, ensuring ease of use;

3. Maintain a continuous supply chain for spare parts, ensuring swift and reliable maintenance;

4. Undertake all maintenance responsibilities, offering routine checks and preventive maintenance services;

5. Conduct regular telephonic follow-ups or personal visits to ensure customer satisfaction and ongoing support;

6. Implement comprehensive 'three guarantees' coverage. It's crucial to understand that after-sales is more than just these guarantees—it encompasses proactive service excellence;

7. Address customer correspondence, visits, and telephonic complaints with prompt attention. We actively gather customer feedback on product quality, ensuring timely improvements and enhanced user experiences.



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