| Customization: | Available |
|---|---|
| After-sales Service: | Video Intallment |
| Power Supply: | 220-380V |
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The Weibang mold test chamber is used to test the ability to resist mold and whether the equipment is subject to harmful effects under conditions conducive to mold growth, that is, in a high-humidity, warm environment and in the presence of inorganic salts. According to the research on the impact of two different groups of test mold species on the main non-metallic materials in GJB150A-2009 "Military Equipment Environmental Test Methods - Mold Test Methods", it analyzes and demonstrates the differences in the degree and grade of mold growth of the same material in test pieces with the same coating and processing techniques.
The strains include:
Aspergillus niger AS3.3928, Penicillium phaeocyanosum AS3.3875, Aspergillus terreus AS3.3935, Paecilomyces variotii AS3.4253, Trichoderma viride AS3.2942, Penicillium roseopurpureum AS3.4302, Aureobasidium pullulans AS3.3984, Cladosporium cladosporioides AS3.3985
Festure:
Test Standard:
1.GJB150.10A-2009 Method for Damp Heat Test
2. GBT 2423.16-2008/IEC 60068-2-10:2005 Mould Growth Test Method
3. GJB 150.10A-2009 Fungus Test
4. GB/T 10588-2006 Technical Conditions for Mould Growth Test Chambers
5. GB-T5170.18-2005 Basic Parameters Verification Method for Environmental Test Equipment of Electrical and Electronic Products - Temperature/Humidity Combined Cycle Test Equipment
6. GB/T 10586-2006 Technical Conditions for Damp Heat Test Chambers
7. HB 6167.11-1989 Environmental Conditions and Test Methods for Aircraft Onboard Equipment - Fungus Test for Civil Aircraft
8. GJB4.10 Environmental Test for Shipborne Electronic Equipment - Fungus Test
Application:
It is widely used in electrical and electronic products, aerospace, automotive electronic components, aviation materials, outdoor communication equipment, tire rubber compounds, ground equipment for military use, outdoor electronic testing equipment, radio frequency front ends, etc.
Packing & Shipping
Specification
| Specification and model of the mold test chamber | ||||||||
| Product Name Product |
Model Model |
Studio volume Volume |
Temperature range Temp.Range |
Humidity range Hum.Range |
Inner box size (width W* depth D* height H) Inner Size |
Outer box size (width W* depth D* height H) Chamber Size |
||
| WBE-MJ series Mold test chamber |
WBE-MJ80LA/B/D | 80(L) | A:-20~+150ºC; B:0~+150ºC; D:+10~+150ºC; |
20%~95%R.h | 400*400*500(mm) | 600*1140*1530(mm) | ||
| WBE-MJ150LA/B/D | 150(L) | 500*500*600(mm) | 700*1530*1630(mm) | |||||
| WBE-MJ225LA/B/D | 225(L) | 600*500*750(mm) | 800*1530*1800(mm) | |||||
| WBE-MJ408LA/B/D | 408(L) | 800*600*850(mm) | 1000*1600*1890(mm) | |||||
| WBE-MJ630LA/B/D | 630(L) | 1000*700*900(mm) | 1200*1730*1980(mm) | |||||
| WBE-MJ1000LA/B/D | 1000(L) | 1000*1000*1000(mm) | 1200*1800*2080(mm) | |||||
| Other specifications can be customized | ||||||||
| Mold test chamber performance parameters | ||||||||
| Performance Parameters | Temperature range | A:-20~+150ºC,B:0~+150ºC,D:+10~+150ºC(GJB150:+10~+80ºC) | ||||||
| Temperature fluctuation | Plus or minus 0.5 ºC or less | |||||||
| Temperature uniformity | 2 ºC or less | |||||||
| Temperature deviation | Plus or minus 2 ºC or less | |||||||
| Rate of heating and cooling | 1 ° C /min full range average (no-load) | |||||||
| Humidity range | 20%~95%R.h | |||||||
| Humidity fluctuation | Plus or minus 2.0% r.h. or less | |||||||
| Humidity uniformity | < 3.0% r.h. | |||||||
| Humidity deviation | Plus or minus 2.0% r.h. (75% r.h. or higher) ~ + / - 5.0% r.h. (or less) of 75% r.h. | |||||||
| Growth environment | Temperature 25 to 30 ° C, humidity 95%R.h | |||||||
| Water for humidification | Distilled water or deionized water | |||||||
| Box material | Inner box | SUS#304 stainless steel | ||||||
| Outer box | Cold-rolled steel plate + double-sided electrostatic spray coating finish, WBE standard blue-gray | |||||||
| Cooling method | The standard is "air-cooled", and "water-cooled" is optional upon request. | |||||||
| Controller | 7-inch color touchscreen control | |||||||